Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10249323
|
Filing Dt:
|
04/01/2003
|
|
Publication #:
|
|
Pub Dt:
|
10/09/2003
| | | | |
|
Inventors:
|
HO-MING TONG, CHUN-CHI LEE, JEN-KUANG FANG, MIN-LUNG HUANG, CHING-HUEI SU, CHAO-FU WENG
|
|
Title:
|
FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| 26, CHIN 3RD. RD., NANTZE EXPORT PROCESSING ZONE |
| KAOHSIUNG, TAIWAN |
|
|
|
|
| JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
| 7 FLOOR-1, NO. 100 |
| ROOSEVELT ROAD, SECTION 2 |
| TAIPEI, TAIWAN 100 |
|
|
Search Results as of:
05/09/2024 07:17 AM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
