Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10411257
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Filing Dt:
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04/11/2003
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Publication #:
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Pub Dt:
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10/16/2003
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Inventors:
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Chung-I Chiang, Ming-Jen Wang, Kun-Hsien Cheng, Hong-Jueng King, Huei-Pin Huang et al
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Title:
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Method for forming soldering layer of fiber arrays
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 42, GUANGFU N. RD. |
| HUKUO SHIANG |
| HSINCHU, TAIWAN R.O.C. |
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| BACON & THOMAS, PLLC |
| EUGENE MAR |
| 625 SLATERS LANE, FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 735 N. PASTORIA AV |
| SUNNYVALE, CALIFORNIA 94086 |
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| BACON & THOMAS, PLLC |
| EUGENE MAR |
| 625 SLATERS LANE FOURTH FLOOR |
| ALEXANDRIA, VA 22314 |
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