Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10128813
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Filing Dt:
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04/23/2002
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Publication #:
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Pub Dt:
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10/23/2003
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Inventors:
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Jan I. Strandberg, Richard Scott Trevino, Thomas B. Blount
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Title:
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High density substrate for the packaging of integrated circuits
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| LITTLE FALLS CENTER II |
| 2751 CENTERVILLE ROAD |
| WILMINGTON, DELAWARE 19808 |
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| TOWNSEND AND TOWNSEND AND CREW LLP |
| WILLIAM L SHAFFER |
| TWO EMBARCADERO CENTER, 8TH FLOOR |
| SAN FRANCISCO, CA 94111-3834 |
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Assignment:
2
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MERGER (SEE DOCUMENT FOR DETAILS).
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| 1005 VIRGINIA DRIVE |
| FORT WASHINGTON, PENNSYLVANIA 19034 |
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| CHRISTOPHER M. SPLETZER, SR. |
| 1005 VIRGINIA DRIVE |
| FORT WASHINGTON, PA 19034 |
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