Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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03/15/2005
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Application #:
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10134617
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Filing Dt:
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04/30/2002
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Publication #:
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Pub Dt:
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10/30/2003
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Inventors:
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Gerald Friese, Werner K. Robl, Axel Brintzinger, Hans-Joachim Barth
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Title:
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BOND PAD STRUCTURE COMPRISING TUNGSTEN OR TUNGSTEN COMPOUND LAYER ON TOP OF METALLIZATION LEVEL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1730 NORTH FIRST STREET |
| SAN JOSE, CALIFORNIA 95112 |
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| INFINEON TECHNOLOGIES NORTH AMERICA CORP |
| ELSA KELLER |
| C/O SIEMENS CORPORATION |
| INTELL. PROP. DEPT., 186 WOOD AVE SOUTH |
| ISELIN, NJ 08830 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| ST. MARTIN-STR. 53 |
| 81541 MUNICH, GERMANY |
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| SIEMENS CORPORATION |
| ELSA KELLER |
| 186 WOOD AVENUE S. |
| IP DEPT. |
| ISELIN, NJ 08830 |
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