Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10439682
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Filing Dt:
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05/16/2003
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Publication #:
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Pub Dt:
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11/20/2003
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Inventors:
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Haijing Lu, Hao Gong, Stephen Chee Khuen Wong
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Title:
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Wafer level electroless copper metallization and bumping process, and plating solutions for semiconductor wafer and microchip
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Assignment:
1
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SEE RECORDING AT REEL 014527 FRAME 0110. (THIS DOCUMENT RECORDED OVER TO ADD AN OMITTED PAGE OF THE COVER SHEET LISTING THE SECOND ASSIGNEE)
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| 10 KENT RIDGE CRESCENT |
| SINGAPORE, SINGAPORE 119260 |
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| DINSMORE & SHOHL, L.L.P. |
| JAMES E. BEYER |
| ONE DAYTON CENTRE |
| ONE SOUTH MAIN STREET, SUITE 500 |
| DAYTON, OHIO 45402 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 10 KENT RIDGE CRESCENT |
| SINGAPORE, SINGAPORE 119260 |
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| 10 SCIENCE ROAD, #01-01-03 |
| THE ALPHA, SINGAPORE SCIENCE PARK 2 |
| SINGAPORE, SINGAPORE 117684 |
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| DINSMORE & SHOHL, L.L.P. |
| JAMES E. BEYER |
| ONE DAYTON CENTRE |
| ONE SOUTH MAIN STREET, SUITE 500 |
| DAYTON, OH 45402 |
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