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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10151783
Filing Dt:
05/20/2002
Publication #:
Pub Dt:
11/20/2003
Inventors:
Hisatomo Ohno, Jun Watanabe, Toshihiro Izumi, Yasushi Yoshizawa
Title:
Non-foamed polishing pad and polishing method therewith
Assignment: 1
Reel/Frame:
012926/0422Recorded: 05/20/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/01/2002
Exec Dt:
05/07/2002
Exec Dt:
05/07/2002
Exec Dt:
05/09/2002
Assignee:
3-4-1 MUSASHINO, AKISHIMA
TOKYO, JAPAN
Correspondent:
BEYER WEAVER & THOMAS, LLP
P.O. BOX 778
BERKELEY, CA 94704-0778
Assignment: 2
Reel/Frame:
014593/0200Recorded: 10/14/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
09/10/2003
Exec Dt:
09/10/2003
Exec Dt:
09/10/2003
Exec Dt:
09/10/2003
Exec Dt:
09/10/2003
Exec Dt:
09/10/2003
Assignee:
3-4-1 MUSASHINO, AKISHIMA
TOKYO, JAPAN
Correspondent:
BEYER WEAVER & THOMAS, LLP
KEIICHI NISHIMURA
P.O. BOX 778
BERKELEY, CA 94704-0778

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