Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10153163
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Filing Dt:
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05/21/2002
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Publication #:
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Pub Dt:
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11/27/2003
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Inventors:
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Daniel Patrick Chesire, Gerard Zaneski, Mary Drummond Roby, Daniel Joseph Vitkavage et al
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Title:
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Bond pad support structure for a semiconductor device
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 555 UNION BOULEVARD |
| ALLENTOWN, PENNSYLVANIA 18109 |
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| BEUSSE BROWNLEE BOWDOIN, ET AL. |
| ROBERT L. WOLTER, ESQ. |
| 390 N. ORANGE AVE., STE. 2500 |
| ORLANDO, FL 32801 |
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