Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10414043
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Filing Dt:
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04/16/2003
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Publication #:
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Pub Dt:
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11/27/2003
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Inventors:
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Cheng Heng Kao, Cheng En Ho, L. C. Shiau
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Title:
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Solder joints with low consumption rate of nickel layer
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 300, JUNG-DA RD., JUNG-LI CITY |
TAOYUAN, TAIWAN R.O.C. |
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ROSENBERG, KLEIN & LEE |
MORTON J. ROSENBERG, ESQ. |
3458 ELLICOTT CENTER DRIVE, SUITE 101 |
ELLICOTT CITY, MD 21043 |
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