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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10439589
Filing Dt:
05/16/2003
Publication #:
20030221969
Pub Dt:
12/04/2003
Inventors:
Manabu Tomisaka, Eiichi Ando, Kiyoshi Shimada, Hirotaka Nobata, Tetsuji Oishi, Yusuke Abe et al
Title:
Method for filling blind via holes
Assignment: 1
Reel/Frame:
014329/0849Recorded: 07/30/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
TOMISAKA, MANABU
Exec Dt:
07/02/2003
ANDO, EIICHI
Exec Dt:
07/02/2003
SHIMADA, KIYOSHI
Exec Dt:
07/02/2003
NOBATA, HIROTAKA
Exec Dt:
07/02/2003
OISHI, TETSUJI
Exec Dt:
07/02/2003
ABE, YUSUKE
Exec Dt:
07/02/2003
SONODA, HARUKI
Exec Dt:
07/02/2003
TATEHABA, YOSHIHITO
Exec Dt:
07/02/2003
OHTA, YASUO
Exec Dt:
07/02/2003
SUDA, KAZUYUKI
Exec Dt:
07/02/2003
Assignees:
DENSO CORPORATION
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF. 448-8661, JAPAN
SPC ELECTRONICS CORPORATION
1-3, SHIBASAKI 2-CHOME
CHOFU-SHI, TOKYO, JAPAN
Correspondent:
HARNESS DICKEY & PIERCE P.L.C.
H. KEITH MILLER
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303
Assignment: 2
Reel/Frame:
015268/0167Recorded: 04/26/2004Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
SPC ELECTRONICS CORPORATION
Exec Dt:
04/12/2004
Assignee:
DENSO CORPORATION
1-1, SHOWA-CHO
KARIYA-CITY, AICHI-PREF. 448-8661, JAPAN
Correspondent:
HARNESS, DICKEY & PIERCE, P.L.C.
H. KEITH MILLER, ESQ.
P.O. BOX 828
BLOOMFIELD HILLS, MI 48303

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