Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/28/2005
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Application #:
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10165401
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Filing Dt:
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06/07/2002
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Publication #:
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Pub Dt:
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12/11/2003
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Inventors:
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Christopher L. Rumer, Saikumar Jayaraman
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Title:
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MICROELECTRONIC PACKAGING AND METHODS FOR THERMALLY PROTECTING PACKAGE INTERCONNECTS AND COMPONENTS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| INTEL LEGAL DEPARTMENT, JF3-147 |
| 2111 N.E. 25TH AVENUE |
| HILLSBORO, OREGON 97124 |
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| SCHWABE, WILLIAMSON & WYATT |
| PAUL J. FORDENBACHER |
| 1211 SW FIFTH AVENUE |
| SUITES 1600-1900 |
| PORTLAND, OR 97204 |
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