Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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06/01/2004
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Application #:
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10248992
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Filing Dt:
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03/07/2003
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Publication #:
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Pub Dt:
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12/25/2003
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Inventors:
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Cheng-Yi Liu, Shen-Jie Wang, Cheng-Heng Kao
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Title:
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FLIP CHIP INTERCONNCETION STRUCTURE AND PROCESS OF MAKING THE SAME
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2F., NO.764, ZHONGZHENG RD., ZHONGHE DIST., |
| NEW TAIPEI CITY, TAIWAN 235 |
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| WPAT., P.C. |
| 8230 BOONE BLVD, SUITE 405 |
| VIENNA, VA 22182 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO.8, LI-HSIN ROAD. VI, HSINCHU SCIENCE PARK |
| HSINCHU, TAIWAN 300-78 |
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| MCCLURE, QUALEY & RODACK, LLP |
| 400 INTERSTATE NORTH PARKWAY SE |
| SUITE 200 |
| ATLANTA, GA 30339 |
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