Patent Assignment Abstract of Title
NOTE:Results display only for issued patents and published applications.
For pending or abandoned applications please consult USPTO staff.
|
Total Assignments:
1
|
|
Patent #:
|
NONE
|
Issue Dt:
|
|
Application #:
|
10175071
|
Filing Dt:
|
06/19/2002
|
|
Publication #:
|
|
Pub Dt:
|
12/25/2003
| | | | |
|
Inventors:
|
Ming-Dou Ker, Wen-Yu Lo
|
|
Title:
|
Electrostatic discharge protection scheme for flip-chip packaged integrated circuits
|
|
|
Assignment:
1
|
|
|
|
|
|
|
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
|
|
|
|
|
|
|
|
|
| SCIENCE-BASED INDUSTRIAL PARK |
| NO. 16, CREATION RD. 1, |
| HSIN CHU, TAIWAN ROC |
|
|
|
|
| NEEDLE & ROSENBERG, P.C. |
| TIM TINGKANG XIA, ESQ. |
| THE CANDLER BUILDING |
| 127 PEACHTREE STREET, N.E. |
| ATLANTA, GEORGIA 30303-1811 |
|
|
Search Results as of:
05/12/2024 04:01 PM
If you have any comments or questions concerning the data displayed,
contact
PRD / Assignments at 571-272-3350. v.2.6
Web interface last modified:
August 25, 2017 v.2.6
|
