Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/24/2005
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Application #:
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10345692
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Filing Dt:
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01/15/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Inventors:
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Hsieh Kun Lee, DongYun Lee, Zhijie Zhang
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Title:
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HEAT DISSIPATION ASSEMBLY WITH FAN MOUNTING DEVICE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 66 CHUNG SHAN ROAD |
| TU-CHEN TAIPEI HSIEN, TAIWAN |
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| FOXCONN INTERNATIONAL, INC. |
| WEI TE CHUNG |
| 1650 MEMOREX DRIVE |
| SANTA CLARA, CA 95050 |
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