Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/10/2004
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Application #:
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10381034
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Filing Dt:
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03/21/2003
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Publication #:
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Pub Dt:
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01/01/2004
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Inventors:
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Kazuhiko Kurafuchi, Naoya Suzuki, Masao Kawasumi, Masaaki Yasuda, Tatsuo Kawata et al
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Title:
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RESIN-SEALED SEMICONDUCTOR DEVICE, AND DIE BONDING MATERIAL AND SEALING MATERIAL FOR USE THEREIN
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-1, NISHISHINJUKUC 2-CHOME, SHINJUKU-KU |
| TOKYO 163-0449, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| WILLIAM I. SOLOMON |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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