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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10405383
Filing Dt:
04/02/2003
Publication #:
Pub Dt:
01/01/2004
Inventors:
Steven M. Scheifers, Andrew Skipor, Daniel Gamota
Title:
Microelectronic assembly with die support and method
Assignment: 1
Reel/Frame:
015735/0156Recorded: 02/15/2005Pages: 64
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
12/10/2004
Assignee:
6501 WILLIAM CANNON
DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
ROBERT L. KING
7700 WEST PARMER LANE
AUSTIN, TX 78729

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