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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10184858
Filing Dt:
06/28/2002
Publication #:
Pub Dt:
01/01/2004
Inventors:
Cindy K. Goldberg, Yeong-Jyn T. Lii
Title:
Interconnect structure and method for forming
Assignment: 1
Reel/Frame:
013076/0077Recorded: 06/28/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/28/2002
Exec Dt:
06/28/2002
Assignee:
LAW DEPARTMENT
1303 EAST ALGONQUIN ROAD
SCHAUMBURG, ILLINOIS 60196
Correspondent:
MOTOROLA, INC.
JOANNA G. CHIU
7700 W. PARMER LANE
AUSTIN, TEXAS 78729
Assignment: 2
Reel/Frame:
015360/0718Recorded: 05/07/2004Pages: 37
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/04/2004
Assignee:
6501 WILLIAM CANNON DRIVE WEST
AUSTIN, TEXAS 78735
Correspondent:
FREESCALE SEMICONDUCTOR, INC.
JENNIFER B. WUAMETT
7700 W. PARMER LANE
MD:TX32/PL02
AUSTIN, TX 78729-8084

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