Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10363640
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Filing Dt:
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08/14/2003
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Publication #:
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Pub Dt:
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01/15/2004
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Inventors:
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Tadahiro Ohmi, Shigetoshi Sugawa, Masaki Hirayama, Tetsuya Goto
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Title:
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Substrate treating device and substrate treating method, substrate flattening method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-17-301, KIMEGAFUKURO 2-CHOME, AOBA-KU, SENDAI-SHI |
| 980-0813 MIYAGI, JAPAN |
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| 3-6, AKASAKA 6-CHOME, MINATO-KU |
| TOKYO, JAPAN 107-8481 |
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| FINNEGAN, HENDERSON & FARABOW, GARRETT |
| MR. ERNEST F. CHAPMAN |
| 1300 I STREET, N.W. |
| WASHINGTON, D.C. 20005-3315 |
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Assignment:
2
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RE-RECORD TO CORRECT BOTH ASSIGNEE'S ADDRESS, PREVIOUSLY RECORDED ON REEL014386 FRAME 0797, ASSIGNOR CONFIRMS THE ASSIGNMENT OF THE ENTIRE INTEREST.
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| 1-17-301, KOMEGAFUKURO 2-CHOME |
| AOBA-KU, SENDAI-SHI |
| MIYAGI 980-0813, JAPAN |
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| 3-6, AKASAKA 5-CHOME, MINATO-KU |
| TOKYO 107-8481, JAPAN |
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| FINNEGAN, HENDERSON, FARABOW, GARRETT & |
| LLP |
| 1300 I STREET, NW |
| WASHINGTON, DC 20005 |
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