Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/30/2005
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Application #:
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10413564
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Filing Dt:
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04/15/2003
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Publication #:
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Pub Dt:
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01/15/2004
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Inventors:
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Tadatomo Suga, Keisuke Saito, Yoshikazu Matsuura, Tatsuya Takeuchi, Sakie Yamagata et al
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Title:
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REFLOW SOLDERING METHOD
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3-6-3 HIGASHINAKANO |
| NAKANO-KU, TOKYO, JAPAN |
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| 1-35, TAKATSUKADAI 3-CHOME |
| NISHI-KU, KOBE-SHI |
| HYOGO 651-2271, JAPAN |
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN 120-8555 |
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| MICHAEL TOBIAS |
| #40 |
| 1717 K STREET N.W., SUITE 613 |
| WASHINGTON, DC 20036 |
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