Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/18/2004
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Application #:
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10195995
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Filing Dt:
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07/16/2002
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Publication #:
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Pub Dt:
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01/22/2004
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Inventors:
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Wei H. Koh, David H. Chen
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Title:
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MULTI-LEVEL PACKAGE FOR A MEMORY MODULE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 17600 NEWHOPE STREET |
| FOUNTAIN VALLEY, CALIFORNIA 92708 |
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| MORLAND C. FISCHER |
| 2030 MAIN STREET, |
| SUITE 1050 |
| IRVINE, CA 92614 |
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