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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10381301
Filing Dt:
07/24/2003
Publication #:
Pub Dt:
02/05/2004
Inventor:
Hitoshi Tomita
Title:
Molded resin for radiation shielding
Assignment: 1
Reel/Frame:
014310/0757Recorded: 07/24/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/10/2003
Assignees:
17-4, SUMIDA 5-CHOME
SUMIDA=KU, TOKYO, 131-0031, JAPAN
2-2, UMEDA 1-CHOME
KITA-KU, OSAKA-SHI, OSAKA 530-0001, JAPAN
Correspondent:
HOGAN & HARTSON L.L.P.
ANTHONY J. ORLER, ESQ.
500 SOUTH GRAND AVENUE, SUITE 1900
LOS ANGELES, CA 90071
Assignment: 2
Reel/Frame:
015031/0804Recorded: 02/24/2004Pages: 3
Conveyance:
RECORD TO CORRECT THE ADDRESS OF THE FIRST ASSIGNEE ON REEL 014310 FRAME 0757
Assignor:
Exec Dt:
07/10/2003
Assignees:
17-4, SUMIDA 5-CHOME,
SUMIDA-KU, TOKYO, 131-0031, JAPAN
2-2, UMEDA 1-CHOME
KITA-KU, OSAKA-SHI, OSAKA 530-0001, JAPAN
Correspondent:
HOGAN & HARTSON L.L.P.
ANTHONY J. ORIER, ESQ.
500 SOUTH GRAND AVENUE, SUITE 1900
LOS ANGELES, CA 90071

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