Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/04/2006
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Application #:
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10431275
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Filing Dt:
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05/07/2003
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Publication #:
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Pub Dt:
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02/05/2004
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Inventors:
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Hung-Jen Hsu, Yu-Kung Hsiao, Chih-Kung Chang, Sheng-Liang Pan, Fu-Tien Weng
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Title:
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NOVEL MATERIAL TO IMPROVE IMAGE SENSOR YIELD DURING WAFER SAWING
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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121 PARK AVENUE ROAD 3 |
SCIENCE BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN ROC |
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WON JOON KOUH |
DUANE MORRIS LLP |
P.O. BOX 5203 |
PRINCETON, NJ 08543-5203 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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NO. 8, LI-HSIN ROAD 6 |
SCIENCE-BASED INDUSTRIAL PARK |
HSIN-CHU, TAIWAN R.O.C. |
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WON JOON KOUH |
DUANE MORRIS LLP |
P.O. BOX 5203 |
PRINCETON, NJ 08543-5203 |
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