Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10249560
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Filing Dt:
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04/18/2003
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Publication #:
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Pub Dt:
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02/26/2004
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Inventors:
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Chung-Liang Hsiao, Chih-Kung Huang
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Title:
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DOUBLE LEADFRAME-BASED PACKAGING STRUCTURE AND MANUFACTURING PROCESS THEREOF
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1FL., NO. 172, SEC. 2, NANJING E. RD., JUNGSHAN CHIU |
TAIPEI, TAIWAN 104 |
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JIANQ CHYUN INTELLECTUAL PROPERTY OFFICE |
7 FLOOR-1, NO. 100 |
ROOSEVELT ROAD, SECTION 2 |
TAIPEI, TAIWAN 100 |
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