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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
Issue Dt:
09/20/2005
Application #:
10333368
Filing Dt:
01/16/2003
Publication #:
Pub Dt:
02/26/2004
Inventors:
Hideotoshi Abe, Yorinobu Takamatsu
Title:
ADHESIVE COMPOSITION AND ADHERED STRUCTURE WHICH THERMALLY PEELED WITH EASE
Assignment: 1
Reel/Frame:
014296/0879Recorded: 01/16/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
12/25/2002
Exec Dt:
01/06/2003
Assignee:
P.O. BOX 33427
ST. PAUL, MINNESOTA 55133-3427
Correspondent:
3M INNOVATIVE PROPERTIES COMPANY
PO BOX 33427
ST. PAUL, MN 55133-3427

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