Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10214144
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Filing Dt:
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08/08/2002
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Publication #:
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Pub Dt:
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02/26/2004
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Inventors:
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Jeng-Mei Liu, Yi-Ying Chiang, Ming-Sheng Yang
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Title:
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Thermal process for reducing copper via distortion and crack
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 3, LI-HSIN RD. 2 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| LOWE HAUPTMAN GILMAN & BERNER (22429) |
| BENJAMIN J. HAUPTMAN |
| 1700 DIAGONAL ROAD, SUITE 310 |
| ALEXANDRIA, VA 22314 |
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