Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10232364
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Filing Dt:
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09/03/2002
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Publication #:
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Pub Dt:
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03/11/2004
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Inventors:
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Seiichiro Kanno, Ken Yoshioka, Ryoji Nishio, Saburou Kanai, Hideki Kihara, Koji Okuda et al
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Title:
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Wafer processing apparatus, wafer stage, and wafer processing method
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-24-14, NISHI SHIMBASHI, MINATO-KU |
| TOKYO 105-8717, JAPAN |
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| ANTONELLI, TERRY, STOUT & KRAUS, LLP |
| MELVIN KRAUS |
| 1300 NORTH SEVENTEENTH STREET |
| SUITE 1800 |
| ARLINGTON, VA 22209 |
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