Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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Issue Dt:
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07/13/2010
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Application #:
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10433314
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Filing Dt:
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06/02/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Inventors:
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Yuji Sato, Shirou Yoshino, Hiroshi Furukawa, Hiroyuki Matsuyama
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Title:
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METHOD OF HEAT TREATMENT OF SILICON WAFER DOPED WITH BORON
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 25-1, SHINOMIYA 3-CHOME |
| HIRABSUKA-SHI |
| KANAGAWA, STATELESS 254-0014 |
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| WELSH & KATZ, LTD |
| GERALD T. SHEKLETON |
| 120 SOUTH RIVERSIDE PLAZA |
| 22ND FLOOR |
| CHICAGO, IL 60606 |
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Assignment:
2
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CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
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| 1324-2, MASURAGAHARA-MACHI |
| OMURA-SHI |
| NAGASAKI, JAPAN 856-8555 |
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| GERALD T. SHEKLETON |
| 120 S. RIVERSIDE PLAZA, 22ND FLOOR |
| CHICAGO, IL 60606 |
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