Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10399268
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Filing Dt:
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04/16/2003
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Publication #:
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Pub Dt:
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03/11/2004
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Inventors:
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Koji Okada, Kaoru Takagahara
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Title:
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Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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2-4, NAKANOSHIMA 3-CHOME |
KITA-KU, OSAKA-SHI, OSAKA 530-0005, JAPAN |
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HOGAN & HARTSON L.L.P. |
DARIUSH G. ADIL, ESQ. |
500 SOUTH GRAND AVENUE |
SUITE 1900 |
LOS ANGELES, CA 90071 |
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