Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10398829
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Filing Dt:
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09/22/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Inventors:
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Masaru Seita, Hideki Tsuchida, Masaru Kusaka
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Title:
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Copper electroplating method using insoluble anode
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 455 FOREST STREET |
| MARLBOROUGH, MASSACHUSETTS 01752 |
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| EDWARDS & ANGELL, LLP |
| PETER F. CORLESS |
| PO BOX 9169 |
| BOSTON, MA 02209 |
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