Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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08/29/2006
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Application #:
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10242797
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Filing Dt:
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09/13/2002
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Publication #:
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Pub Dt:
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03/18/2004
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Inventors:
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Isamu Satou, Shinichi Nomoto, Hiroshi Okada
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Title:
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SOLDER BALL
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 23 SENJU-HASHIDO-CHO |
| ADACHI-KU, TOKYO, JAPAN |
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| MICHAEL TOBIAS |
| #40 |
| 1717 K STREET N.W., SUITE 613 |
| WASHINGTON, DC 20036 |
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