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Patent Assignment Abstract of Title
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Total Assignments: 2
Patent #:
NONE
Issue Dt:
Application #:
10243363
Filing Dt:
09/12/2002
Publication #:
Pub Dt:
03/18/2004
Inventors:
David Suitwai Ma, George W. Alexander, James J. Dietz
Title:
Semiconductor die isolation system
Assignment: 1
Reel/Frame:
013520/0930Recorded: 11/21/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/13/2002
Exec Dt:
11/12/2002
Exec Dt:
11/12/2002
Assignee:
1730 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95112
Correspondent:
BRINKS HOFER GILSON & LIONE
RICHARD K. CLARK
P.O. BOX 10395
CHICAGO, IL 60610
Assignment: 2
Reel/Frame:
013842/0978Recorded: 08/01/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
07/23/2003
Assignee:
ST. MARTIN-STR. 53
MUNICH, GERMANY 81669
Correspondent:
SIEMENS CORPORATION
STANTON C. BRADEN, ESQ.
186 WOOD AVENUE SOUTH
INTELLECTUAL PROPERTY DEPARTMENT
ISELIN, NJ 08830

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