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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
Issue Dt:
08/30/2005
Application #:
10432597
Filing Dt:
06/03/2003
Publication #:
Pub Dt:
03/18/2004
Inventors:
Yoshihisa Abe, Shunichi Suzuki, Hideo Nakanishi, Kazutaka Terashima, Juno Komiyama
Title:
SEMICONDUCTOR WAFER AND ITS MANUFACTURING METHOD
Assignment: 1
Reel/Frame:
014529/0103Recorded: 06/03/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
04/08/2003
Exec Dt:
04/08/2003
Exec Dt:
04/08/2003
Exec Dt:
04/08/2003
Exec Dt:
04/08/2003
Assignee:
5-25, NISHI-SHINJUKU 7-CHOME
SHINJUKU-KU, TOKYO 160-0023, JAPAN
Correspondent:
FOLEY & LARDNER
RICHARD L. SCHWAAB
WASHINGTON HARBOUR
3000 K STREET, N.W., SUITE 500
WASHINGTON, D.C. 20007-5143
Assignment: 2
Reel/Frame:
019817/0749Recorded: 09/13/2007Pages: 17
Conveyance:
MERGER (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
06/01/2007
Assignee:
6-3, OHSAKI 1-CHOME, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
DAVID J. CUSHING - SUGHRUE MION PLLC
20-20, KAIGAN 3-CHOME, MINATO-KU
SUITE 800
WASHINGTON, D.C, DC 20037
Assignment: 3
Reel/Frame:
038399/0880Recorded: 04/11/2016Pages: 40
Conveyance:
CHANGE OF NAME & ADDRESS
Assignor:
Exec Dt:
10/01/2015
Assignee:
11-1, OSAKI 2-CHOME, SHINAGAWA-KU
TOKYO, JAPAN
Correspondent:
CPA GLOBAL LTD
LIBERATION HOUSE
CASTLE STREET
ST HELIER, JE1 1BL JERSEY

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