Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10614783
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Filing Dt:
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07/09/2003
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Publication #:
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Pub Dt:
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03/18/2004
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Inventors:
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Hiroomi Torii, Hideo Aizawa, Satoshi Wakabayashi
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Title:
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Polishing apparatus and method of bonding and removing expendable replacement components thereof
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 11-1, HANEDA ASAHI-CHO, OHTA-KU |
| TOKYO, JAPAN |
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| WENDEROTH, LIND & PONACK LLP |
| NILS E. PEDERSEN |
| 2033 K STREET, N.W., SUITE 800 |
| WASHINGTON, D.C. 20006-1021 |
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