Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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03/04/2008
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Application #:
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10666129
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Filing Dt:
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09/22/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Inventors:
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Osamu Munekata, Yoshitaka Toyoda, Tsukasa Ohnishi, Minoru Ueshima
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Title:
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LEAD-FREE SOLDER ALLOY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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23 SENJU-HASHIDO-CHO, ADACHI-KU |
TOKYO, JAPAN |
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MICHAEL TOBIAS |
1629 K STREET, N.W., SUITE 300 |
WASHINGTON, D.C. 20006 |
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