Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/16/2006
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Application #:
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10668154
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Filing Dt:
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09/24/2003
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Publication #:
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Pub Dt:
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04/01/2004
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Inventors:
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Atsushi Koyama, Mamoru Usami, Kenji Yamaga, Mikio Domon, Kazuki Suzawa
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Title:
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MOLD COMPONENT AND MOLD ASSEMBLY
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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1-13-1, NIHONBASHI, CHUO-KU |
TOKYO 103-8272, JAPAN |
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GREENBLUM & BERNSTEIN, P.L.C. |
BRUCE H. BERSTEIN |
1950 ROLAND CLARK PLACE |
RESTON, VA 20191 |
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