Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10265826
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Filing Dt:
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10/07/2002
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Publication #:
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Pub Dt:
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04/08/2004
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Inventors:
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Chun-Wei Chen, Hong-Long Chang, Nien-Yu Tsai
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Title:
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Method of reducing wafer etching defect
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 3 FL., NO. 19, LI-SHING ROAD |
| HSINCHU SCIENCE-BASED |
| INDUSTRAL PARK, HSINCHU CITY, TAIWAN R.O.C. |
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| LADAS & PARRY |
| WILLIAM R. EVANS |
| 26 WEST 61 STREET |
| NEW YORK, NY 10023 |
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