Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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06/29/2004
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Application #:
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10264398
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Filing Dt:
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10/05/2002
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Publication #:
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Pub Dt:
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04/08/2004
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Inventors:
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Chung-Chi Ko, Yung-Cheng Lu, Lain-Jong Li, Shu-E Ku, Yu-Huei Chen, Lih-Ping Li
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Title:
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METHOD FOR FORMING A CAPPING LAYER OVER A LOW-K DIELECTRIC WITH IMPROVED ADHESION AND REDUCED DIELECTRIC CONSTANT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 121 PARK AVENUE 3 |
| SCIENCE BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN R.O.C. |
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| TUNG & ASSOCIATES |
| RANDY W. TUNG |
| 838 W. LONG LAKE ROAD |
| SUITE 120 |
| BLOOMFIELD HILLS, MI 48302 |
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