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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10468775
Filing Dt:
08/21/2003
Publication #:
Pub Dt:
04/15/2004
Inventor:
Kazuma Sekiya
Title:
SEMINCONDUCTOR CHIP MANUFACTURING METHOD INCLUNDING ETCHING STEP TO REMOVE DISTORTION AND TO SEPARATE CHIPS.
Assignment: 1
Reel/Frame:
014816/0282Recorded: 08/21/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
08/05/2003
Assignee:
14-3, HIGASHI KOJIYA 2-CHOME
OTA-KU, TOKYO 144-0033, JAPAN
Correspondent:
WENDEROTH LIND & PONACK, LLP
CHARLES R. WATTS, ESQ.
2033 K STREET, N.W.
SUITE 800
WASHINGTON, DC 20006-1021

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