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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10467010
Filing Dt:
07/31/2003
Publication #:
Pub Dt:
04/15/2004
Inventors:
Naoto Iizuka, Takashi Nihonmatsu, Masahiko Yoshida, Seiichi Miyazaki
Title:
Production method for silicon wafer and silicon wafer and soi wafer
Assignment: 1
Reel/Frame:
014724/0273Recorded: 07/31/2003Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
06/04/2003
Exec Dt:
05/30/2003
Exec Dt:
06/02/2003
Exec Dt:
06/02/2003
Assignee:
4-2, MARUNOUCHI 1-CHOME CHIYODA-KU,
TOKYO, JAPAN
Correspondent:
HOGAN & HARTSON L.L.P.
ANTHONY J. ORLER, ESQ.
500 SOUTH GRAND AVENUE, SUITE 1900
LOS ANGELES, CA 90071

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