Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10630858
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Filing Dt:
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07/31/2003
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Publication #:
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Pub Dt:
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04/22/2004
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Inventors:
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Keiichi Okajima, Hiroshi Oda, Takahiro Nakano
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Title:
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Method for forming solder-resist film
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1-2, OYODOKITA 2-CHOME KITA-KU |
| OSAKA-CITY, OSAKA, JAPAN 531-8511 |
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| TOWNSEND & BANTA |
| DONALD E. TOWNSEND |
| SUITE 900, SOUTH BLDG. |
| 601 PENNSYLVANIA AVE., N.W. |
| WASHINGTON, DC 20004 |
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