Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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Issue Dt:
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08/17/2004
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Application #:
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10279703
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Filing Dt:
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10/24/2002
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Publication #:
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Pub Dt:
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04/29/2004
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Inventor:
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Chris Wyland
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Title:
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THERMAL-CONDUCTIVE SUBSTRATE PACKAGE
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| GROENEWOUDSEWEG 1 |
| EINDOVEN, NETHERLANDS 5621 BA |
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| PHILLIPS ELECTRONICS NORTH AMERICA CORP. |
| PETER ZAWILSKI |
| INTELLECTUAL PROPERTY & STANDARDS |
| 1000 WEST MAUDE AVENUE |
| SUNNYVALE, CA 94085 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| HIGH TECH CAMPUS 60 |
| 5656 AG EINDHOVEN, NETHERLANDS |
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| ELIZABETH PARSONS |
| 1825 EYE STREET, NW |
| WASHINGTON, DC 20006 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 8, LI-HSIN RD. 6 |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN 300-77 |
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| DAVID M. O'DELL |
| HAYNES AND BOONE, LLP - IP SECTION |
| 2323 VICTORY AVENUE, SUITE 700 |
| DALLAS, TX 75219 |
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