Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10383757
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Filing Dt:
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03/10/2003
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Publication #:
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Pub Dt:
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04/29/2004
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Inventors:
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Wen-Lo Shieh, Fu-Yu Huang, Ning Huang, Hui-Pin Chen, Shu-Wan Lu, Zhe-Sung Wu, Chih-Yu Tsai et al
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Title:
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Fabrication method for solder bump pattern of rear section wafer package
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 9, CHUNG SAN ST., N.E.P.Z. |
| KAOHSIUNG, TAIWAN |
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| WEN LO SHIEH |
| PO BOX 82-144 |
| TAIPEI, TAIWAN |
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