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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
NONE
Issue Dt:
Application #:
10282388
Filing Dt:
10/29/2002
Publication #:
Pub Dt:
04/29/2004
Inventors:
Simon Chooi, Mei Sheng Zhou, Subhash Gupta
Title:
Deposition of barrier metal in damascene interconnects using metal carbonyl
Assignment: 1
Reel/Frame:
013441/0289Recorded: 10/29/2002Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
05/03/2001
Exec Dt:
05/03/2001
Exec Dt:
05/03/2001
Assignee:
60 WOODLANDS INDUSTRIAL PARK D
STREET 2
SINGAPORE 738406, SINGAPORE
Correspondent:
GEORGE O. SAILE
28 DAVIS AVENUE
POUGHKEEPSIE, NEW YORK 12603

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