Patent Assignment Abstract of Title
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Total Assignments:
3
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10300468
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Filing Dt:
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11/20/2002
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Publication #:
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Pub Dt:
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05/20/2004
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Inventors:
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Soon-Cheon Seo, Wei-Tsu Tseng, Darryl D. Restaino, James E. Fluegel, Richard O. Henry et al
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Title:
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Method of forming planar Cu interconnects without chemical mechanical polishing
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NEW ORCHARD ROAD |
| ARMONK, NEW YORK 10504 |
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| TIFFANY L. TOWNSEND |
| 2070 ROUTE 52 |
| HOPEWELL JUNCTION, NY 12533 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 2070 ROUTE 52 |
| HOPEWELL JUNCTION, NEW YORK 12533 |
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| HESLIN ROTHENBERG FARLEY & MESITI P.C. |
| 5 COLUMBIA CIRCLE |
| ALBANY, NY 12203 |
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Assignment:
3
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| PO BOX 309 |
| UGLAND HOUSE |
| GRAND CAYMAN, CAYMAN ISLANDS KY1-1104 |
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| HESLIN ROTHENBERG FARLEY & MESITI P.C. |
| 5 COLUMBIA CIRCLE |
| ALBANY, NY 12203 |
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