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Patent Assignment Abstract of Title
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Total Assignments: 1
Patent #:
6998327
Issue Dt:
02/14/2006
Application #:
10299567
Filing Dt:
11/19/2002
Publication #:
20040097078
Pub Dt:
05/20/2004
Inventors:
Jeffrey B. Danielson, Balaram Ghosal, James Kuss, Matthew Wayne Oonk, Chandrika Prasad et al
Title:
THIN FILM TRANSFER JOIN PROCESS AND MULTILEVEL THIN FILM MODULE
Assignment: 1
Reel/Frame:
013518/0230Recorded: 11/19/2002Pages: 13
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
DANIELSON, JEFFREY B.
Exec Dt:
10/08/2002
GHOSAL, BALARAM
Exec Dt:
11/01/2002
KUSS, JAMES
Exec Dt:
10/02/2002
OONK, MATHEW W.
Exec Dt:
10/03/2002
PRASAD, CHANDRIKA
Exec Dt:
10/01/2002
PERFECTO, ERIC D.
Exec Dt:
10/25/2002
YU, ROY
Exec Dt:
10/05/2002
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
IRA D. BLECKER
2070 ROUTE 52, INTELL PROP. LAW DEPT.
DEPT. 18G/BLDG. 300-482
HOPEWELL JUNCTION, NY 12533-6531

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