Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10306626
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Filing Dt:
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11/27/2002
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Publication #:
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Pub Dt:
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05/27/2004
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Inventors:
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Yuan Yuan, Burton J. Carpenter
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Title:
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Solder joint reliability by changing solder pad surface from flat to convex shape
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 1303 EAST ALGONQUIN ROAD |
| A CORPORATION OF DELAWARE |
| SCHAUMBURG, ILLINOIS 60196 |
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| JOHN A. FORTKORT P.C. |
| JOHN A. FORTKORT |
| 4512 COURT OF ST. JAMES |
| AUSTIN, TX 78730 |
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Assignment:
2
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 6501 WILLIAM CANNON DRIVE WEST |
| AUSTIN, TEXAS 78735 |
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| FREESCALE SEMICONDUCTOR, INC. |
| JENNIFER B. WUAMETT |
| 7700 W. PARMER LANE |
| MD:TX32/PL02 |
| AUSTIN, TX 78729-8084 |
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