Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10683814
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Filing Dt:
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10/09/2003
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Publication #:
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Pub Dt:
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05/27/2004
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Inventors:
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Chih-Liang Chu, E-Tung Chou, Lin-Yin Wong
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Title:
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Semiconductor package substrate having bonding pads with plated layer thereon and process of manufacturing the same
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| NO. 6, LI-HSIN ROAD |
| SCIENCE-BASED INDUSTRIAL PARK |
| HSIN-CHU, TAIWAN ROC |
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| FULBRIGHT & JAWORSKI L.L.P. |
| ROBERT BERLINER |
| 865 SOUTH FIGUEROA |
| TWENTY-NINTH FLOOR |
| LOS ANGELES, CA 90017-2571 |
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