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Patent Assignment Abstract of Title
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Total Assignments: 4
Patent #:
Issue Dt:
06/06/2006
Application #:
10719379
Filing Dt:
11/20/2003
Publication #:
Pub Dt:
05/27/2004
Inventors:
Hiroshi Uragami, Osamu Nakagawa, Kinya Fujino, Shinji Takase, Hideki Tokuyama et al
Title:
METHOD OF RESIN ENCAPSULATION, APPARATUS FOR RESIN ENCAPSULATION, METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND RESIN MATERIAL
Assignment: 1
Reel/Frame:
014736/0880Recorded: 11/20/2003Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
Exec Dt:
11/05/2003
Exec Dt:
11/05/2003
Exec Dt:
11/05/2003
Exec Dt:
11/05/2003
Exec Dt:
11/05/2003
Exec Dt:
11/12/2003
Exec Dt:
11/12/2003
Exec Dt:
11/12/2003
Assignees:
5, KAMITOBA KAMICHOSHI-CHO MINAMI-KU, KYOTO-SHI
KYOTO, JAPAN
1-1, KAMIKODANAKA 4-CHOME NAKAHARA-KU, KAWASAKI-SHI
KANAGAWA 211-8588, JAPAN
Correspondent:
FASSE PATENT ATTORNEYS, PA
WALTER F. FASSE
P.O. BOX 726
HAMPDEN, MAINE 04444-0726
Assignment: 2
Reel/Frame:
022248/0521Recorded: 02/13/2009Pages: 10
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/23/2009
Assignee:
7-1, NISHI-SHINJUKU 2-CHOME, SHINJUKU-KU
TOKYO, JAPAN 163-0722
Correspondent:
WESTERMAN, HATTORI, DANIELS & ADRIAN, LL
1250 CONNECTICUT AVENUE, NW
SUITE-700
WASHINGTON, DC 20036-2657
Assignment: 3
Reel/Frame:
024776/0288Recorded: 08/03/2010Pages: 8
Conveyance:
CHANGE OF NAME (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
04/01/2010
Assignee:
2-10-23 SHIN YOKOHAMA, KOHOKU-KU
YOKOHAMA-SHI, KANAGAWA, JAPAN 222-0033
Correspondent:
FASSE PATENT ATTORNEYS, P.A.
P O BOX 726
HAMPDEN, ME 04444
Assignment: 4
Reel/Frame:
037786/0316Recorded: 02/22/2016Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
Exec Dt:
01/29/2016
Assignee:
2-10-23 SHIN-YOKOHAMA
KOHOKU-KU YOKOHAMA-SHI
KANAGAWA, JAPAN 222-0033
Correspondent:
BIRCH, STEWART, KOLASCH & BIRCH, LLP
PO BOX 747
FALLS CHURCH, VA 22040-0747

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