Patent Assignment Abstract of Title
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Total Assignments:
1
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Patent #:
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Issue Dt:
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05/23/2006
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Application #:
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10724803
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Filing Dt:
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12/01/2003
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Publication #:
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Pub Dt:
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06/10/2004
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Inventors:
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Tetsuya Oda, Choichiro Fujii, Etsuo Nishikawa
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Title:
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METHOD OF FORMING THICK-FILM WIRING AND METHOD OF PRODUCING LAMINATED ELECTRONIC COMPONENT
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 26-10 TENJIN 2-CHOME, NAGAOKAKYO-SHI |
| KYOTO-FU 617-8555, JAPAN |
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| KEATING & BENNETT LLP |
| JOSEPH R. KEATING, ESQ. |
| 10400 EATON PLACE, SUITE 312 |
| FAIRFAX, VA 22030 |
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