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Patent Assignment Abstract of Title
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Total Assignments: 3
Patent #:
7241696
Issue Dt:
07/10/2007
Application #:
10318606
Filing Dt:
12/11/2002
Publication #:
20040115921
Pub Dt:
06/17/2004
Inventors:
Larry Clevenger, Timothy Joseph Dalton, Mark Hoinkis, Staffen K. Kaldor, Chih-Chao Yang et al
Title:
METHOD FOR DEPOSITING A METAL LAYER ON A SEMICONDUCTOR INTERCONNECT STRUCTURE HAVING A CAPPING LAYER
Assignment: 1
Reel/Frame:
013594/0442Recorded: 12/11/2002Pages: 2
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
HOINKIS, MARK
Exec Dt:
12/06/2002
Assignee:
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
1730 NORTH FIRST STREET
SAN JOSE, CALIFORNIA 95112
Correspondent:
IBM CORPORATION
IRA DAVID BLECKER
DEPT. 18G/BLDG. 300-482
2070 ROUTE 52
HOPEWELL JUNCTION, NY 12533-6531
Assignment: 2
Reel/Frame:
013594/0444Recorded: 12/11/2002Pages: 4
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignors:
CLEVENGER, LARRY
Exec Dt:
12/10/2002
DALTON, TIMOTHY J.
Exec Dt:
12/06/2002
KALDOR, STEFFEN K.
Exec Dt:
11/22/2002
KUMAR, KAUSHIK
Exec Dt:
12/03/2002
LA TULIPE, JR., DOUGLAS C.
Exec Dt:
12/06/2002
SEO, SOON-CHEON
Exec Dt:
11/22/2002
SIMON, ANDREW H.
Exec Dt:
11/25/2002
WANG, YUN-YU
Exec Dt:
11/22/2002
YANG, CHIH-CHAO
Exec Dt:
11/26/2002
YANG, HSINING
Exec Dt:
12/03/2002
Assignee:
INTERNATIONAL BUSINESS MACHINES CORPORATION
NEW ORCHARD ROAD
ARMONK, NEW YORK 10504
Correspondent:
IBM CORPORATION
IRA D. BLECKER
2070 ROUTE 52, DEPT. 18G/BLDG. 300-482
INTELLECTUAL PROPERTY LAW DEPT.
HOPEWELL JUNCTION, NY 12533-6531
Assignment: 3
Reel/Frame:
013773/0601Recorded: 07/02/2003Pages: 3
Conveyance:
ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
Assignor:
INFINEON TECHNOLOGIES NORTH AMERICA CORP.
Exec Dt:
07/02/2003
Assignee:
INFINEON TECHNOLOGIES AG
ST. MARTIN-STR. 53
81541 MUNICH, GERMANY
Correspondent:
SIEMENS CORPORATION
ELSA KELLER
186 WOOD AVENUE SOUTH
INTELLECTUAL PROP. DEPT.
ISELIN, NJ 08830

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