Patent Assignment Abstract of Title
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Total Assignments:
2
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Patent #:
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NONE
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Issue Dt:
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Application #:
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10453605
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Filing Dt:
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06/04/2003
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Publication #:
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Pub Dt:
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06/24/2004
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Inventors:
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Katsuhiro Taguchi, Yuichi Tanaka, Toru Kimura, Takanori Okita
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Title:
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DIE BONDING APPARATUS
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Assignment:
1
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ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS).
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| 4-1, MARUNOUCHI 2-CHOME |
| CHIYODA-KU, TOKYO, JAPAN 100-6335 |
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| 6-2, OOTEMACHI 2-CHOME |
| CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| 700 THIRTEENTH STREET, N.W., SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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Assignment:
2
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A CORRECTIVE ASSIGNMENT TO CORRECT THE ASSIGNEE NAME ON REEL 014148 FRAME 0128
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| 4-1, MARUNOUCHI 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-6334 |
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| 6-2, OOTEMACHI, 2-CHOME, CHIYODA-KU |
| TOKYO, JAPAN 100-0004 |
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| LEYDIG, VOIT & MAYER |
| JEFFREY A. WYAND |
| 700 THIRTEENTH ST., N.W. SUITE 300 |
| WASHINGTON, D.C. 20005-3960 |
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